Leading Industrial NAND Storage Solutions from Flexxon
Standard & Bespoke Memory Solutions with Fixed BOM supported by High-Mix, Low Volume Production
NAND Flash Modules and Devices
Flexxon NAND Flash Product Features
Product Series Features: Click to expand Features tables
| Series | INSPIRE INSPIRE II | ACHIEVER ACHIEVER PRO | XTREME XTREME II | XCEL | GALAXY |
|---|---|---|---|---|---|
| Feature | High Endurance & Wide Compatibility with 3D NAND Suitable for Multi-Tasking Applications Supports Hardware PLP | High Performance & High Density Suitable for Main Storage Applications | High Performance & DRAM-less design Perfect for Embedded Applications | Ultra High Density &Ultimate Performance | Enchanced Reliability & Security Design for Military Application |
| Interface | SATA III | SATA III | SATA III | SATA III | SATA III |
| Form Factor | 2.5", M.2 2242/2260/2280, mSATA | 1.8”, 2.5” Half Slim, mSATA, M.2 2242/2260/2280, CFast, SATA DOM | 2.5", Half Slim, mSATA, mSATA mini, M.2 2242/2260/2280, CFast, uSSD, SATA DOM | 2.5", M.2 2280 | 2.5" |
| Flash Type | 3D TLC, 3D pSLC | SLC, MLC, pSLC | SLC, MLC, pSLC, 3D TLC, 3D pSLC | 3D TLC | SLC, MLC |
| Capacity | 3D TLC: 64GB ~ 2TB 3D pSLC: 16GB~256GB | SLC: 4GB ~ 128GB MLC: 8GB ~ 512GB pSLC: 4GB~256GB | SLC: 8GB ~ 128GB MLC: 4GB ~ 512GB pSLC: 2GB ~ 256GB 3D TLC: 16GB ~ 1TB 3D pSLC: 32GB ~128GB | 3D TLC: 128GB ~ 8TB | SLC: 32GB ~ 512GB MLC: 64GB ~ 1TB |
| Max Performance | Read: 550 MB/s Write: 520 MB/s | Read: 510 MB/s Write: 450 MB/s | Read: 550 MB/s Write: 500 MB/s | Read: 550 MB/s Write: 530 MB/s | Read: 520 MB/s Write: 440 MB/s |
| Grade | Industrial | Industrial | Industrial / Commercial | Industrial / Commercial | Military |
| Series | GEX | DEX | DEX Pro | HIX | VEX |
|---|---|---|---|---|---|
| Feature | Ultra-High Performance & Reliability Suitable For Client Applications | DRAM-Less design with High Speed & Compatibility Suitable for Main Storage & Client Applications | DRAM design with high Speed & Compatibility Suitable for Industrial & Client Applications | Ultimate Performance & Density Perfect for Enterprise Applications | PCIe Gen 4 solution with Extreme Performance |
| Interface | PCIe Gen 3×4, NVMe 1.3 | PCIe Gen 3×4, NVMe 1.3 | PCIe Gen 3×4, NVMe 1.3 | PCIe Gen 3×4, NVMe 1.3 | PCIe Gen 4×4, NVMe 1.4 |
| Form Factor | M.2 2280 | M.2 2280 | M.2 2280 | U.2, M.2 2280, M.2 22110 | M.2 2280 |
| Flash Type | 3D NAND | 3D NAND | 3D NAND | 3D NAND | 3D NAND |
| Capacity | 256GB ~ 2TB | 128GB ~ 1TB | 128GB ~ 1TB | 128GB ~ 8TB | 500GB ~ 8TB |
| Max Performance | Read: 3370 MB/s Write: 2859 MB/s | Read: 1860 MB/s Write: 1374 MB/s | Read: 1378 MB/s Write: 1850 MB/s | Read: 3200 MB/s Write: 3000 MB/s | Read: 7000 MB/s Write: 6850 MB/s |
| Grade | Industrial | Industrial | Industrial | Industrial / Commercial | Industrial / Commercial |
| Series | IMP-I | IMP-I Pro | ||
|---|---|---|---|---|
| Feature | Suitable for Read & Write balance application; Good Endurance and Performance | Suitable for Write focus application; High Endurance Better Performance |
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| Interface | PCIe Gen 3×4, NVMe 1.3 | PCIe Gen 4×4, NVMe 1.4 | PCIe Gen 3×4, NVMe 1.3 | PCIe Gen 4×4, NVMe 1.4 |
| Form Factor | E1.S | U.2, U.3, AIC | E1.S | U2 |
| Flash Type | 3D NAND | 3D NAND | ||
| Capacity | 1.92TB ~ 3.84TB | 960GB ~ 30.72TB | 1.60TB ~ 3.20TB | 3.20TB ~ 12.80TB |
| Max Performance | Read: 3500 MB/s Write: 2500 MB/s | Read: 7500 MB/s Write: 6000 MB/s | Read: 3500 MB/s Write: 2500 MB/s | Read: 7500 MB/s Write: 6000 MB/s |
| DWPD (5 years) | 1 | 3 | ||
| Grade | Enterprise 0~70C | Enterprise 0~70C | ||
Flexxon's Enterprise NVMe SSD provides high capacity up to 15.36 TB which is an ideal solution for data centers and enterprise applications.
| Series | CLASSIC | CLASSIC II | LEGACY III | LEGACY III | |
|---|---|---|---|---|---|
| Feature | Suitable for Embedded Applications | High IOPS Performance, High Capacity & High Reliability Supports AES Encryption | Best for Rigorous Applications Cost-e ective SLC solution Supports small capacity | High Compatibility & High Performance Supports Power Loss Protection |
|
| Compliance | Ultra DMA Mode 4 | Ultra DMA Mode 6 | CF Spec Ver. 6.1 Ultra DMA Mode 6 | CF Spec Ver. 4.1 Ultra DMA Mode 6 | CF Spec Ver. 6.x Ultra DMA Mode 7 |
| Form Factor | PATA DOM | 2.5” PATA SSD | CF Card | CF Card | CF Card |
| Flash Type | SLC | SLC, MLC | SLC | SLC, MLC, pSLC | |
| Capacity | 128MB ~ 4GB | SLC: 1GB ~ 128GB MLC: 4GB ~ 1TB | SLC: 1GB ~ 32GB MLC: 4GB ~ 128GB | SLC: 128MB ~ 8GB | SLC: 4GB ~ 32GB MLC: 8GB ~ 128GB pSLC: 4GB ~ 64GB |
| Max Performance | Read: 43 MB/s Write: 28 MB/s | Read: 86 MB/s Write: 75 MB/s | Read: 86 MB/s Write: 75 MB/s | Read: 51 MB/s Write: 40 MB/s | Read: 106MB/s Write: 80 MB/s |
| Grade | Industrial | Industrial | Industrial | Industrial | Industrial |
| Series | FxAdv II | FxMav | FxPro I High IOPS | FxPro I | FxPrem II | FxPro III | SD Express | eSD |
|---|---|---|---|---|---|---|---|---|
| Feature | Advanced High IOPS Solution with 3D NAND | Advanced High IOPS and High Capacity 3D NAND | High IOPS Solution with 2D NAND | High Performance with 2D NAND | High Capacity 2D NAND Solution | Extreme Performance UHS-II Solution | SD Express Card | Embedded SD JEDEC 100Ball BGA |
| Interface | SD 6.1 | SD 6.1 | SD 6.1 | SD 3.0/6.1 | SD 3.0 | SD 6.1 | SD 7.1 | SD 2.0/3.0 |
| Speed Class | Up to Class 10, U3, V30, A2 | Up to Class 10, U3, V30, A2 | Up to Class 10, U3, V30, A1 | Up to Class 10, U3, V30 | Up to Class 10, U3, V30 | Up to Class 10, U3, V90, A1 | Up to U3, V30, A1 | Up to Class 10, U1, V10 |
| UHS mode | UHS-1 | UHS-1 | UHS-1 | UHS-1 | UHS-1 | UHS-1 | UHS-I, PCIE Gen 3x1 | UHS-1 |
| Flash Type | 3D TLC, 3D pSLC | 3D QLC | SLC, MLC, pSLC | SLC, MLC, pSLC | SLC, MLC, pSLC | 3D TLC, 3D pSLC | 3D QLC | SLC, MLC, pSLC |
| Capacity | 3D TLC: 64GB ~ 512GB 3D pSLC: 16GB ~ 128GB | 3D QLC: 128GB ~ 1TB | SLC: 512MB ~ 16GB MLC: 4GB ~ 32GB pSLC: 2GB ~ 16GB | SLC: 128MB ~ 16GB MLC: 1GB ~ 128GB pSLC: 2GB ~ 64GB | SLC: 4GB ~ 32GB MLC: 8GB ~ 256GB pSLC: 4GB ~ 128GB | 3D TLC: 64GB ~ 1TB 3D pSLC: 32GB ~ 512GB | 3D QLC: 256GB ~ 512GB | SLC: 512MB ~ 16GB MLC: 8GB ~ 64GB pSLC: 4GB ~ 32GB |
| Max Performance | Read: 95 MB/s Write: 90 MB/s | Read: 100 MB/s Write: 90 MB/s | Read: 95 MB/s Write: 90 MB/s | Read: 95 MB/s Write: 90 MB/s | Read: 95 MB/s Write: 80 MB/s | Read: 290 MB/s Write: 260 MB/s | Read: 900 MB/s Write: 770 MB/s | Read: 95 MB/s Write: 80 MB/s |
| Grade | Industrial / Commercial | Commercial | Industrial / Commercial | Industrial / Commercial | Industrial | Commercial | Commercial | Industrial |
| Series | FxU2 III | FxAce II | FxAce | FxAlp | FxReg | ||
|---|---|---|---|---|---|---|---|
| Feature | Standard Performance Supports 3D NAND | High Reliability Solution with 3D NAND High IOPS Solution | High Reliability Solution with 3D NAND High IOPS Solution | High Compatibility & Reliability Supports High IOPS & AES | Wide Compatibility Solution with 3D NAND | ||
| Interface | USB 2.0 | USB 3.2 GEN 1 | USB 3.1 GEN 1 | USB 2.0 | USB 2.0 & USB 3.1 GEN 1 | USB 3.1 GEN 1 | USB 2.0 & USB 3.1 GEN 1 |
| Form Factor | Pen Drive | Pen Drive | Pen Drive | USB DOM (10-pin) | USB DOM (10-pin & 20-pin) | Pen Drive | USB DOM (10-pin & 20-pin) |
| Flash Type | 3D TLC | 3D TLC | 3D TLC, 3D pSLC | SLC, MLC | 3D TLC | MLC, 3D TLC | |
| Capacity | 16GB ~ 64GB | 128GB ~ 256GB | 3D TLC: 32GB ~ 512 GB 3D pSLC: 8GB ~ 128GB | 3D TLC: 32GB ~ 256 GB 3D pSLC: 8GB ~ 64GB | SLC: 1GB ~ 32GB MLC: 4GB ~ 128GB | 64GB ~ 256GB | MLC: 16GB - 256GB 3D TLC: 64GB ~ 56GB |
| Max Performance | Read: 30 MB/s Read: 20 MB/s | Read: 120 MB/s Write: 60 MB/s | Read: 220 MB/s Write: 100 MB/s | Read: 30 MB/s Write: 24 MB/s | Read: 200 MB/s Write: 150 MB/s | Read: 102MB/s Write: 86 MB/s | Read: 102MB/s Write: 86 MB/s |
| Grade | Commercial | Commercial | Industrial | Industrial | Industrial | Industrial | Industrial |
| Series | ECON II | XTRA V | XTRA III | XTRA VII | XTRA VIII | AXO |
|---|---|---|---|---|---|---|
| Interface | eMMC 5.1 | eMMC 5.1 | eMMC 5.1 | eMMC 5.1 | eMMC 5.1 | eMMC 5.1 |
| Flash Type | MLC, 3D TLC | 3D TLC, 3D pSLC | MLC, pSLC | MLC, pSLC, 3D TLC, 3D pSLC | 3D TLC, 3D pSLC | 3D TLC |
| Pin Count | 153-ball | 153-ball | 100-ball / 153-ball | 153-ball | 153-ball | 100-ball / 153-ball |
| Capacity | MLC: 4GB ~ 16GB 3D TLC: 32GB ~ 28GB | D TLC: 16GB~256GB 3D pSLC: 8GB~64GB | MLC: 8GB~16GB pSLC: 4GB~8GB | MLC: 8GB pSLC: 4GB 3D TLC: 16GB~128GB 3D pSLC: 8GB~32GB | 3D TLC: 32GB~128GB 3D pSLC: 8GB~32GB | 64GB~512GB |
| Max Performance | Read: 280 MB/s Write: 200 MB/s | Read: 315 MB/s Write: 240 MB/s | Read: 225 MB/s Write: 140 MB/s | Read: 320 MB/s Write: 255 MB/s | Read: 320 MB/s Write: 260 MB/s | Read: 300 MB/s Write: 200 MB/s |
| Grade | Commercial | Industrial Gold | Industrial Gold & Diamond | Industrial Gold & Diamond | Automotive Grade 3 & Automotive Grade 2 | Industrial & Automotive |
Pre-loaded data integrity in reflow process: Data integrity refers to the reliability and accuracy of data. The eMMC pre-loaded data might get corrupted during soldering. Flexxon eMMC uses pSLC blocks only during the soldering process to ensure no data loss during reflow.
Auto Read Refresh: Auto Read Refresh could monitor the bit errors in every read operation. This is important for reading-intensive applications. To prevent data damage, refresh operation will be triggered when the bit errors are approaching the threshold.
Static and Dynamic Wear Leveling: Flexxon eMMC supports static and dynamic wear leveling. The static wear leveling can shift cold data (system data that is seldom updated) to the block of maximum erase count in the data area. The dynamic wear leveling shifts hot data (updated user data) to the block of minimum erase count in the data area. This could reduce the risk of read disturbance, sustaining data integrity.
Power Loss Protection: Flexxon eMMC supports pSLC Area Backup Technology. Partial NAND is enabled as pSLC to backup data. The pSLC is non-volatile storage which can provide higher read/write performance, endurance and data integrity.
Intelligent Technology: Click to see what we mean
DATA INTEGRITY REFLOW
The Production State Awareness (PSA) feature:
- Utilizes pSLC blocks exclusively during the soldering process.
- Ensures no data loss during reflow.
THERMAL THROTTLING
- Activates thermal throttling through firmware control to enable normal read/write operations under high
temperatures. - Effectively dissipates excess heat without additional hardware costs.
AUTO READ REFRESH
- Monitors bit errors during every read operation.
- Essential for read-intensive applications.
- Triggers refresh operation when bit errors approach the threshold to prevent data damage.
POWER LOSS PROTECTION
- Flexxon eMMC supports pSLC Area Backup Technology with partial NAND enabled as pSLC to backup data.
- The pSLC area is non-volatile storage which can provide higher read/write performance, endurance and data reliability.
- Flexxon eMMC supports UECC handling to detect uncorrectable ECC in programmed pages during sudden power loss.
STATIC & DYNAMIC WEAR LEVELLING
- Preserves important data without relocation.
- Concentrates write/erase cycles on dynamic blocks only.
- Reduces the risk of read disturb and sustains data integrity.
Flexxon is a full service, bespoke, NAND Flash memory module manufacturer.
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X-PHY is an AI Embedded, Cybersecure SSD that prevents Zero-Day attacks due to cyber security software vulnerability.